What You’ll Need

• “EpoxyTable 5-Five” – Deep Pour Epoxy Resin for Tables and Large Projects – Up to 5cm – Suitable for deep casting and complete encapsulation of circuits.
• “3D Finish” – Fast Coating Epoxy Resin for 3D Prints – Ideal for printed housings or fine circuit elements.
• “Carbon Resin” – Epoxy Resin for Carbon Fiber & Fiberglass Coating – Use when extra impact resistance is needed for composite-based electronic assemblies.
• Mixing cups, stirring sticks, and disposable gloves
• Protective mask and eye protection
• Non-stick work surface (e.g., silicone mat)
• Protective tape or putty (for masking areas not to be encapsulated)
• Heat gun or torch (for bubble removal)

Key Application Tools and Workspace Preparation

Organise materials ahead of time. Prepare your workspace and have gloves, cups, and stirring sticks within easy reach. This ensures efficient mixing and application with reduced risk of contamination or error.

Step 1: Prepare the Circuit and Workspace

Begin by ensuring your electronic circuit is fully assembled and thoroughly tested—powering up after encapsulation is not recommended unless you’re certain all solder joints and connections are sound. Remove dust and debris from both the circuit board and your work area. Protect any sections that must not come in contact with resin using non-stick tape or a suitable putty. Work in a dust-free, well-ventilated area, and always wear gloves and eye protection to reduce health risks.

Step 2: Mix the Epoxy Resin Carefully

Select the most suitable resin for your project. For embedding and deep pours, “EpoxyTable 5-Five” offers low exothermic reaction and optimal clarity around intricate layouts, minimising overheating which could damage sensitive components. Measure the two components precisely following the manufacturer’s instructions—too much or too little hardener can impact electrical isolation and finish quality. Stir gently but thoroughly, taking care to avoid introducing excessive air.

Step 3: Embed or Coat the Circuit

Carefully pour or brush the mixed resin over and around your electronic circuit. For deep encapsulation, pour the resin slowly into a mould or prepared enclosure, ensuring the resin covers all components evenly. For housing or surface protection, you might use “3D Finish” for thin, rapid coatings, especially on 3D printed or delicate surfaces. Use a heat gun or torch briefly if small bubbles appear, but avoid excessive heat that may damage circuitry.

Step 4: Curing and Finishing

Allow the resin to cure at room temperature, away from dust and vibrations. Curing times vary by product—”EpoxyTable 5-Five” typically takes 24–48 hours, while “3D Finish” can set in as little as 4 hours. For particularly demanding environments or composite assemblies, “Carbon Resin” adds extra resilience to the finished item. Ensure complete curing before powering the circuit, and avoid handling or trimming until the resin is hard to the touch.

Tips and Common Mistakes

Preventing overheating is vital: Avoid thick pours over heat-sensitive components by working in layers if necessary. Always mix in small batches to limit working time stress. If resin leaks, address them quickly by re-masking or levelling your enclosure. Watch out for air bubbles around component leads and connectors—use a fine brush or light heat to encourage them to rise before the resin begins to cure. Where impact or vibration may be an issue, consider a resin formulated for composite protection and high adhesion strength.

Expert Insights for Confident Resin Encapsulation

Experienced makers recommend testing with an offcut circuit first to gauge how your chosen resin flows and sets, especially if working with sensitive or valuable electronics.